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Adhesive Product List » Thermally Conductive Epoxies
USG165
 Thermally Conductive Epoxies
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USG165 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, addition-curing system that cures at room temperature or elevated temperature to provide... |
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USG172
 Thermally Conductive Epoxies
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USG172 It is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after... |
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USG178
 Thermally Conductive Epoxies
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USG178 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to... |
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