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Adhesive Product List » Potting / Encapsulation
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USG135 It is an epoxy-based low viscosity adhesive for impregnating, coating, potting, and bonding electronic components and devices. It is a two-component, readily flowable, addition-curing system that cures at room... |
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USG149 It is a flexible epoxy adhesive for sealing or encapsulating electronic devices. It is a two-component, flowable formulation that cures at room or elevated temperature to provide strong bonding... |
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USG403 It is a one-part translucent potting gel. It is a flowable, addition-curing, silicone that cures at elevated temperature to a very firm rubbery gel with excellent adhesion to various... |
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USG405 It is a two-part translucent potting gel. It is a flowable, addition-curing, silicone that cures at elevated temperature to a very firm rubbery gel with excellent adhesion to various... |
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USG407 It is a two-part firm potting gel. It is a thixotropic (non-sag), addition-curing, silicone that cures at elevated temperature to a very firm rubbery gel with excellent adhesion to... |
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USG462 It is a two-part firm potting gel. It is an addition-cure, also room temperature curable, silicone that cures to a very firm rubbery gel with excellent adhesion to various... |
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