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Adhesive Product List » Thermal Conducting



USG165

Thermal Conducting
USG165
It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, addition-curing system that cures at room temperature or elevated temperature to provide...

Price from: $0.70 / mL Jar See Details »
USG172

Thermal Conducting
USG172
It is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after...

Price from: $0.80 / mL Jar See Details »
USG178

Thermal Conducting
USG178
It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to...

Price from: $0.70 / mL Jar See Details »




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