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Adhesive Product List » Low CTE



USG130

Low CTE
USG130
It is an epoxy-based low coefficient of thermal expansion (CTE) adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part,...

Price from: $2.53 / mL Syringe See Details »
USG140

Low CTE
USG140
It is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or...

Price from: $0.70 / mL Jar See Details »




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