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Adhesive Product List » Low Stress Die Bond



USG642

Low Stress Die Bond
USG642
It is a silicone-based electrically conductive adhesive designed for electronic applications. After cure at elevated temperature, it forms a flexible, rubbery conductive adhesive having superior electrical and thermal conductivity....

Price from: $32.90 / mL Syringe See Details »
USG646

Low Stress Die Bond
USG646
It is a Silver-Copper filled electrically conductive silicone adhesive designed for electronic applications. After cure at elevated temperature, it forms a flexible, rubbery conductive adhesive having electrical and thermal...

Price from: $18.90 / mL Syringe See Details »




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