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Adhesive Product List » Room Temp Cure
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USG133 It is an epoxy-based adhesive for bonding electronic components and devices. It is a two-component with controlled viscosity for not running or dripping. It cures at room temperature or... |
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USG140 It is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or... |
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