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Adhesive Product List » High Temp Bonding



USG166

High Temp Bonding
USG166
It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong...

Price from: $2.27 / mL Syringe See Details »
USG175

High Temp Bonding
USG175
It is a structural bonding adhesive with thermal stability for electronic applications. It is a two-component, flowable, addition-curing system that cures at elevated temperature to provide strong bonding to...

Price from: $0.65 / mL Jar See Details »
USG182

High Temp Bonding
USG182
It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150C to 210C. It is a one-part, long...

Price from: $1.83 / mL Syringe See Details »




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