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Adhesive Product List » High Temp Bonding
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USG166 It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong... |
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USG175 It is a structural bonding adhesive with thermal stability for electronic applications. It is a two-component, flowable, addition-curing system that cures at elevated temperature to provide strong bonding to... |
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USG182 It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150°C to 210°C. It is a one-part, long... |
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