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Adhesive Product List » Thermal Bonding
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USG165 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, addition-curing system that cures at room temperature or elevated temperature to provide... |
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USG172 It is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after... |
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USG178 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to... |
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USG361 It is a thermally conductive adhesive. It is a flowable, addition-curing, ready-to-use, one-component silicone that cures at elevated temperature to a soft rubber with good thermal conductivity and superior... |
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USG362 It is a high thermally conductive adhesive. It is a non-slump, addition-curing, ready-to-use, one-component silicone that cures rapidly at elevated temperature to a soft rubber with excellent thermal conductivity... |
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USG363 It is a high thermally conductive adhesive. It is a non-slump, addition-curing, ready-to-use, two-component silicone that cures at elevated temperature to a rubber with excellent thermal conductivity and bonding... |
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USG390 It is a high thermally conductive adhesive. It is a non-slump, addition-curing, ready-to-use, two-component silicone that cures at room temperature or elevated temperature to a rubber with excellent thermal... |
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