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Adhesive Product List » Conductive Bonding
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USG660 It is a one component, silver-filled, electrically conductive epoxy adhesive designed for electronic applications. After being cured at elevated temperatures, it forms a structural bonding adhesive with superior electrical... |
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USG661 It is a high electrically conductive adhesive. It is a two-part, silver filled, epoxy-based semi-fluid. It cures fast at elevated temperature to form strong bonding to various metals and... |
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USG663 It is a snap cure, electrically conductive adhesive with an exceptionally fast cure speed (e.g. 15 seconds at 180C). It can be cured in standard soldering reflow process. It... |
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USG677 It is a flexible epoxy electrically conductive adhesive designed for electronic applications. After cure at elevated temperature, it forms a flexible, rubbery conductive adhesive having superior electrical and thermal... |
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USG678 It is an epoxy-based electrically conductive adhesive designed for electronic applications. It is filled with silver-coated-copper conducting filler. After cure at elevated temperature, it forms a strong bonding adhesive... |
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