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Adhesive Product List » Snap / Fast Cure Epoxies
USG137
 Snap / Fast Cure Epoxies
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USG137 It is a snap-cure epoxy adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part, capillary flow formulation that cures... |
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USG182
 Snap / Fast Cure Epoxies
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USG182 It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150°C to 210°C. It is a one-part, long... |
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USG183
 Snap / Fast Cure Epoxies
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USG183 It is a non-slump snap cure epoxy adhesive for electronic bonding applications. It is a one-part, thixotropic (non-slump), and rubber-modified formulation. It can be cured at low temperature. After... |
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USG663
 Snap / Fast Cure Epoxies
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USG663 It is a snap cure, electrically conductive adhesive with an exceptionally fast cure speed (e.g. 15 seconds at 180C). It can be cured in standard soldering reflow process. It... |
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