|
|
 |
Adhesive Product List » Coating Protection
|
USG133 It is an epoxy-based adhesive for bonding electronic components and devices. It is a two-component with controlled viscosity for not running or dripping. It cures at room temperature or... |
|
| |
|
USG182 It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150°C to 210°C. It is a one-part, long... |
|
| |
|
USG601 It is a solvent based, silver-coated copper conductive coating designed for EMI / FRI shielding applications. It dries out quickly in minutes in open air, which is desirable for... |
|
| |
|
USG713 It is room temperature moisture curable conformal coating. It is one-component, solvent-free coating compound. After cure, it forms a rubbery layer with excellent adhesion to most substrates, which provides... |
|
| |
|
USG803 It is a two-part transparent coating and potting gel. It is a flowable, addition-curing, silicone that cures at elevated temperature to a very firm rubbery gel with excellent adhesion... |
|
| |
|
|
|
