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Adhesive Product List » Snap / Fast Cure



USG137

Snap / Fast Cure
USG137
It is a snap-cure epoxy adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part, capillary flow formulation that cures...

Price from: $2.53 / mL Syringe See Details »
USG182

Snap / Fast Cure
USG182
It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150C to 210C. It is a one-part, long...

Price from: $1.83 / mL Syringe See Details »
USG183

Snap / Fast Cure
USG183
It is a non-slump snap cure epoxy adhesive for electronic bonding applications. It is a one-part, thixotropic (non-slump), and rubber-modified formulation. It can be cured at low temperature. After...

Price from: $2.20 / mL Syringe See Details »




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