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Die Attachment
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Snap / Fast Cure
 
        
 
    


Adhesive Product List » Epoxy Die Attachment



USG166

Epoxy Die Attachment
USG166
It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong...

Price from: $2.27 / mL Syringe See Details »
USG182

Epoxy Die Attachment
USG182
It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150C to 210C. It is a one-part, long...

Price from: $1.83 / mL Syringe See Details »




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