Today's Special!
  OUR PROFILE  
  HOME  
  SERVICES  
  TECHNOLOGY  
Sales@USGlue.com
phone: (630) 621 4198

  Types of Adhesives 

All Adhesives
Silicone Adhesives
Thermal Management
Film Lamination
Epoxy Adhesives
Coating & Potting
Sealing Solutions
Electrical Conducting
Optical Applications
Media Protection
Adhesion & Bonding
Die Attachment
   »  Epoxy Die Attachment

   »  Electrically Conductive

   »  Thermally Conductive

   »  Underfill

   »  Low Stress Die Bond

Snap / Fast Cure
 
        
 
    


Adhesive Product List » Die Attachment



USG130

Underfill
USG130
It is an epoxy-based low coefficient of thermal expansion (CTE) adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part,...

Price from: $2.53 / mL Syringe See Details »
USG137

Underfill
USG137
It is a snap-cure epoxy adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part, capillary flow formulation that cures...

Price from: $2.53 / mL Syringe See Details »
USG165

Thermally Conductive
USG165
It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, addition-curing system that cures at room temperature or elevated temperature to provide...

Price from: $0.70 / mL Jar See Details »
USG166

Epoxy Die Attachment
USG166
It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong...

Price from: $2.27 / mL Syringe See Details »
USG172

Thermally Conductive
USG172
It is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after...

Price from: $0.80 / mL Jar See Details »
USG178

Thermally Conductive
USG178
It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to...

Price from: $0.70 / mL Jar See Details »
USG182

Epoxy Die Attachment
USG182
It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150C to 210C. It is a one-part, long...

Price from: $1.83 / mL Syringe See Details »
USG612

Electrically Conductive
USG612
It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural...

Price from: $23.80 / mL Syringe See Details »
USG613

Electrically Conductive
USG613
It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural...

Price from: $19.60 / mL Syringe See Details »
USG619

Electrically Conductive
USG619
It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural...

Price from: $29.80 / mL Syringe See Details »
USG642

Low Stress Die Bond
USG642
It is a silicone-based electrically conductive adhesive designed for electronic applications. After cure at elevated temperature, it forms a flexible, rubbery conductive adhesive having superior electrical and thermal conductivity....

Price from: $32.90 / mL Syringe See Details »
USG646

Low Stress Die Bond
USG646
It is a Silver-Copper filled electrically conductive silicone adhesive designed for electronic applications. After cure at elevated temperature, it forms a flexible, rubbery conductive adhesive having electrical and thermal...

Price from: $18.90 / mL Syringe See Details »
USG660

Electrically Conductive
USG660
It is a one component, silver-filled, electrically conductive epoxy adhesive designed for electronic applications. After being cured at elevated temperatures, it forms a structural bonding adhesive with superior electrical...

Price from: $29.80 / mL Syringe See Details »
USG663

Electrically Conductive
USG663
It is a snap cure, electrically conductive adhesive with an exceptionally fast cure speed (e.g. 15 seconds at 180C). It can be cured in standard soldering reflow process. It...

Price from: $29.80 / mL Syringe See Details »
USG689

Electrically Conductive
USG689
It is an epoxy electrically conductive adhesive that has high thermal conductivity. The latent cure design of this adhesive makes it cure quickly at elevated temperature while keeping a...

Price from: $29.80 / mL Syringe See Details »




Technical Support

  

  Shopping Cart is Empty

For bulk orders,
please call us at:
(630) 621 4198

Questions or comments?
Please send an email to:
info@USGlue.com