|
USG133 It is an epoxy-based adhesive for bonding electronic components and devices. It is a two-component with controlled viscosity for not running or dripping. It cures at room temperature or... |
|
 |
|
USG140 It is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or... |
|
| |
|
USG165 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, addition-curing system that cures at room temperature or elevated temperature to provide... |
|
| |
|
USG166 It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong... |
|
| |
|
USG169 It is a water clear optically transparent epoxy adhesive / potting compound for L.E.D. encapsulating, fiber optics, clear potting, or any optical and electronic applications. After the two components... |
|
| |
|
USG172 It is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after... |
|
| |
|
USG175 It is a structural bonding adhesive with thermal stability for electronic applications. It is a two-component, flowable, addition-curing system that cures at elevated temperature to provide strong bonding to... |
|
| |
|
USG178 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to... |
|
| |
|
USG182 It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150°C to 210°C. It is a one-part, long... |
|
| |
|
USG361 It is a thermally conductive adhesive. It is a flowable, addition-curing, ready-to-use, one-component silicone that cures at elevated temperature to a soft rubber with good thermal conductivity and superior... |
|
| |
|
USG362 It is a high thermally conductive adhesive. It is a non-slump, addition-curing, ready-to-use, one-component silicone that cures rapidly at elevated temperature to a soft rubber with excellent thermal conductivity... |
|
| |
|
USG363 It is a high thermally conductive adhesive. It is a non-slump, addition-curing, ready-to-use, two-component silicone that cures at elevated temperature to a rubber with excellent thermal conductivity and bonding... |
|
| |
|
USG390 It is a high thermally conductive adhesive. It is a non-slump, addition-curing, ready-to-use, two-component silicone that cures at room temperature or elevated temperature to a rubber with excellent thermal... |
|
| |
|
USG414 It is a one-part water clear potting gel. It is a flowable, addition-curing, silicone that cures at elevated temperature to a very firm optically clear rubbery gel for casting... |
|
| |
|
USG425 It is a two-part water clear potting gel. It is a flowable, addition-curing, silicone that cures fast at elevated temperature to a very firm optically clear rubbery gel for... |
|
| |
|
USG660 It is a one component, silver-filled, electrically conductive epoxy adhesive designed for electronic applications. After being cured at elevated temperatures, it forms a structural bonding adhesive with superior electrical... |
|
| |
|
USG661 It is a high electrically conductive adhesive. It is a two-part, silver filled, epoxy-based semi-fluid. It cures fast at elevated temperature to form strong bonding to various metals and... |
|
| |
|
USG663 It is a snap cure, electrically conductive adhesive with an exceptionally fast cure speed (e.g. 15 seconds at 180C). It can be cured in standard soldering reflow process. It... |
|
| |
