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Adhesive Product List » Sealing Solutions
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USG140 It is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or... |
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USG711 It is a room temperature cure silicone adhesives sealant. It is a one-component, non-slump silicone paste that cures when it is exposed to ambient moisture. After cure, it forms... |
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USG846
 Silicone Heat Cure Sealants
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USG846 It is a high bonding strength adhesive. It is a non-slump (thixotropic), addition-curing, one component silicone that cures at elevated temperature to a very tough rubber with excellent bonding... |
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USG847
 Silicone Heat Cure Sealants
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USG847 It is a high bonding strength adhesive. It is a non-slump (thixotropic), addition-curing, two-component silicone that cures at elevated temperature to a very tough rubber with excellent bonding strength... |
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USG847
 Silicone Heat Cure Sealants
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USG847 It is a high bonding strength adhesive. It is a non-slump (thixotropic), addition-curing, two-component silicone that cures at elevated temperature to a very tough rubber with excellent bonding strength... |
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