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USG130 It is an epoxy-based low coefficient of thermal expansion (CTE) adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part,... |
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USG130 It is an epoxy-based low coefficient of thermal expansion (CTE) adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part,... |
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USG135 It is an epoxy-based low viscosity adhesive for impregnating, coating, potting, and bonding electronic components and devices. It is a two-component, readily flowable, addition-curing system that cures at room... |
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USG137 It is a snap-cure epoxy adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part, capillary flow formulation that cures... |
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USG140 It is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or... |
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USG149 It is a flexible epoxy adhesive for sealing or encapsulating electronic devices. It is a two-component, flowable formulation that cures at room or elevated temperature to provide strong bonding... |
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USG165 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, addition-curing system that cures at room temperature or elevated temperature to provide... |
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USG166 It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong... |
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USG166 It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong... |
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USG169 It is a water clear optically transparent epoxy adhesive / potting compound for L.E.D. encapsulating, fiber optics, clear potting, or any optical and electronic applications. After the two components... |
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USG172 It is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after... |
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USG175 It is a structural bonding adhesive with thermal stability for electronic applications. It is a two-component, flowable, addition-curing system that cures at elevated temperature to provide strong bonding to... |
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USG178 It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to... |
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USG182 It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150°C to 210°C. It is a one-part, long... |
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USG183 It is a non-slump snap cure epoxy adhesive for electronic bonding applications. It is a one-part, thixotropic (non-slump), and rubber-modified formulation. It can be cured at low temperature. After... |
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USG612 It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural... |
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USG613 It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural... |
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USG619 It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural... |
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