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Adhesive Product List » Epoxy Adhesives



USG130

Low CTE
USG130
It is an epoxy-based low coefficient of thermal expansion (CTE) adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part,...

Price from: $2.53 / mL Syringe See Details »
USG130

Epoxy Undefill
USG130
It is an epoxy-based low coefficient of thermal expansion (CTE) adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part,...

Price from: $2.53 / mL Syringe See Details »
USG135

Impregnable
USG135
It is an epoxy-based low viscosity adhesive for impregnating, coating, potting, and bonding electronic components and devices. It is a two-component, readily flowable, addition-curing system that cures at room...

Price from: $0.33 / mL Bottle See Details »
USG137

Epoxy Undefill
USG137
It is a snap-cure epoxy adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part, capillary flow formulation that cures...

Price from: $2.53 / mL Syringe See Details »
USG140

Low CTE
USG140
It is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or...

Price from: $0.70 / mL Jar See Details »
USG149

Flexible Epoxy
USG149
It is a flexible epoxy adhesive for sealing or encapsulating electronic devices. It is a two-component, flowable formulation that cures at room or elevated temperature to provide strong bonding...

Price from: $0.33 / mL Bottle See Details »
USG165

Thermal Conducting
USG165
It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, addition-curing system that cures at room temperature or elevated temperature to provide...

Price from: $0.70 / mL Jar See Details »
USG166

High Tg High Temp
USG166
It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong...

Price from: $2.27 / mL Syringe See Details »
USG166

Die Attach Epoxy
USG166
It is a fast cure epoxy adhesive for structural bonding applications. It is a one-part, thixotropic formulation that has high Tg after cures at elevated temperature. It provides strong...

Price from: $2.27 / mL Syringe See Details »
USG169

Optical Epoxy
USG169
It is a water clear optically transparent epoxy adhesive / potting compound for L.E.D. encapsulating, fiber optics, clear potting, or any optical and electronic applications. After the two components...

Price from: $0.84 / mL Bottle See Details »
USG172

Thermal Conducting
USG172
It is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after...

Price from: $0.80 / mL Jar See Details »
USG175

High Tg High Temp
USG175
It is a structural bonding adhesive with thermal stability for electronic applications. It is a two-component, flowable, addition-curing system that cures at elevated temperature to provide strong bonding to...

Price from: $0.65 / mL Jar See Details »
USG178

Thermal Conducting
USG178
It is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to...

Price from: $0.70 / mL Jar See Details »
USG182

Fast Snap Cure
USG182
It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150C to 210C. It is a one-part, long...

Price from: $1.83 / mL Syringe See Details »
USG183

Fast Snap Cure
USG183
It is a non-slump snap cure epoxy adhesive for electronic bonding applications. It is a one-part, thixotropic (non-slump), and rubber-modified formulation. It can be cured at low temperature. After...

Price from: $2.20 / mL Syringe See Details »
USG612

Die Attach Epoxy
USG612
It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural...

Price from: $23.80 / mL Syringe See Details »
USG613

Die Attach Epoxy
USG613
It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural...

Price from: $19.60 / mL Syringe See Details »
USG619

Die Attach Epoxy
USG619
It is a one component, anisotropic, electrically conductive epoxy adhesive designed for electronic applications. After a rapid snap-cure at elevated temperatures in seconds with thermo-compression, it forms a structural...

Price from: $29.80 / mL Syringe See Details »

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