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Adhesive Product List » Film Lamination
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USG133 It is an epoxy-based adhesive for bonding electronic components and devices. It is a two-component with controlled viscosity for not running or dripping. It cures at room temperature or... |
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USG135 It is an epoxy-based low viscosity adhesive for impregnating, coating, potting, and bonding electronic components and devices. It is a two-component, readily flowable, addition-curing system that cures at room... |
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USG137 It is a snap-cure epoxy adhesive for underfilling or encapsulating chip-on-board, bare die, BGA, flip-chip, CSP, and other electronic applications. It is a one-part, capillary flow formulation that cures... |
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USG182 It is a snap cure epoxy adhesive for electronic bonding applications. It can be cured in 8 to 30 seconds at 150°C to 210°C. It is a one-part, long... |
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USG183 It is a non-slump snap cure epoxy adhesive for electronic bonding applications. It is a one-part, thixotropic (non-slump), and rubber-modified formulation. It can be cured at low temperature. After... |
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USG414 It is a one-part water clear potting gel. It is a flowable, addition-curing, silicone that cures at elevated temperature to a very firm optically clear rubbery gel for casting... |
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USG425 It is a two-part water clear potting gel. It is a flowable, addition-curing, silicone that cures fast at elevated temperature to a very firm optically clear rubbery gel for... |
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